It is the technology of choice for the emerging power electronics market segment, and also a very promising candidate for future high performance and low cost High Brightness LED manufacturing. The wafer size and material plays a crucial role when it comes to cost effective manufacturing processes, and thus the transition to 200 mm Standard Silicon wafers is a logical next step on the manufacturing roadmaps, as it offers unique economies of scale.”
”Being convinced that uniformity and yield are the key success criteria in 200 mm GaN-on-Si processes, AIXTRON conducted a dedicated R&D program”, adds Dr. Frank Wischmeyer, Vice President and Program Manager Power Electronics at AIXTRON. “We started the development process by conducting an extensive simulation program, which enabled us to design fundamentally new hardware components that provide unique process performance in our 5x200 mm processes, while still being compatible with the well-proven AIX G5 reactor platform.” The results are extremely stable processes, providing much better uniformity of material properties and enabling higher device yield than any other MOCVD platform, whilst offering a reactor capacity of 5x200 mm.
Some initial feedback from customers confirms the success of this technological development. Many of them have noted in particular that the fully rotationally symmetrical uniformity pattern on all five 200 mm wafers, the use of standard thickness silicon substrates and the controlled wafer bow behavior is exactly what they require for silicon-style manufacturing.
Tridonic has appointed Alfred Felder as its new CEO, to take the place of Walter Ziegler who left the company in January after a company shakeup prompted by the “technology shift to LEDs”. Felder is set to take office on November, 1.
”Being convinced that uniformity and yield are the key success criteria in 200 mm GaN-on-Si processes, AIXTRON conducted a dedicated R&D program”, adds Dr. Frank Wischmeyer, Vice President and Program Manager Power Electronics at AIXTRON. “We started the development process by conducting an extensive simulation program, which enabled us to design fundamentally new hardware components that provide unique process performance in our 5x200 mm processes, while still being compatible with the well-proven AIX G5 reactor platform.” The results are extremely stable processes, providing much better uniformity of material properties and enabling higher device yield than any other MOCVD platform, whilst offering a reactor capacity of 5x200 mm.
Some initial feedback from customers confirms the success of this technological development. Many of them have noted in particular that the fully rotationally symmetrical uniformity pattern on all five 200 mm wafers, the use of standard thickness silicon substrates and the controlled wafer bow behavior is exactly what they require for silicon-style manufacturing.
Tridonic has appointed Alfred Felder as its new CEO, to take the place of Walter Ziegler who left the company in January after a company shakeup prompted by the “technology shift to LEDs”. Felder is set to take office on November, 1.
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