the existing metal layer using a conductive adhesive

The highprecision stamping is ideally suited to the manufacture of small structures in the range of bridge and slot widths up to 60 μm in 40 μm thin materials as well as for mass production. These strengths of material enable low package heights and provide in addition the advantage of being considerably more flexible. As opposed to the more classical printed circuit board, SCB offers the means to simply structure the layer of plastic and so create new possibilities for contacting.

The components can be directly placed on top of the existing metal layer using a conductive adhesive and contacted along the backside of the metal. This means that in the case of temperature‐sensitive components a whole new form of thermal management is created, whereby the thermal energy can be directly dissipated through the conductive copper layer. As a result the inexpensive SCB mass production process means that modular superstructures can be achieved which are capable of producing overall heat conducting values comparable to those of ceramic respectively plastic injection molded superstructures.

Building on their already successful LED manufacturing business, Samsung offer a growing range of medium and high power LEDs for general lighting, street lighting and signage applications. Samsung are transferring their LED manufacturing expertise into the lighting business by utilising their established global facilities (from chip making to the final package) and overall LED know how which have been developed from LEDs for TVs, mobile phones and laptop computers.

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